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| CM1414 2 Channel Headset EMI Filter with ESD Protection Features * * * * * * * * * * Functionally and pin compatible with CMD's CSPEMI204 OptiGuardTM coated for improved reliability at assembly Two channels of EMI filtering, one for a microphone and one for an earpiece speaker Pi-style EMI filters in a capacitor-resistor-capacitor (C-R-C) network Greater than 35dB attenuation in the 8002700MHz range +8kV ESD protection on each channel (IEC 610004-2 Level 4, contact discharge) +15kV ESD protection on each channel (HBM) Chip Scale Package features extremely low parasitic inductance for optimum filter performance 5-bump, 0.950mm X 1.41mm footprint Chip Scale Package (CSP) Lead-free version available Product Description The CM1414 is a low-pass filter array designed specifically to reduce EMI/RFI emissions and provide ESD protection for a headset port on a cellular and mobile devices. The CM1414 integrates two high quality, pistyle filters (C-R-C) filters, one for a microphone and one for an earpiece or speaker, each providing more than 35dB attenuation relative to the pass band attenuation in the 800-2700 MHz range. These filters support bidirectional filtering, reducing EMI both to and from the headset port and support bipolar audio signals without distortion. In addition, the CM1414 provides a very high level of protection for sensitive electronic components that may be subject to electrostatic discharge (ESD). The input pins are designed and characterized to safely dissipate ESD strikes of +8kV contact discharge, the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than +15kV. The CM1414 protects sensitive components such as CPU and DSPs that have much weaker internal ESD protection circuitry usually only intended for mechanical handling protection. The CM1414 is particularly well suited for portable electronics because of its small package format and low weight. The CM1414 incorporates OptiGuardTM coating which results in improved reliability at assembly and is available in a space-saving, low-profile Chip Scale Package with optional lead-free finishing. Applications * * * * * * EMI filtering and ESD protection for headset microphone and earpiece speaker ports Cellular / Mobile Phones Notebooks and Personal Computers Handheld PCs / PDAs / Tablets Wireless Handsets Digital Camcorders Electrical Schematic EAR_IN A1 10 C1 EAR_OUT MIC_IN A3 68 C3 MIC_OUT 100pF 100pF GND B2 (c) 2005 California Micro Devices Corp. All rights reserved. 11/03/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 47pF 47pF Fax: 408.263.7846 www.calmicro.com 1 CM1414 PACKAGE / PINOUT DIAGRAMS TOP VIEW (Bumps Down View) Orientation Marking (see note 2) BOTTOM VIEW (Bumps Up View) 123 A CC A3 MIC_IN A1 EAR_IN Orientation Marking B C B2 GND C3 MIC_OUT C1 EAR_OUT Notes: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. CM1414 CSP Package PIN DESCRIPTIONS PIN A1 A3 B2 C1 C3 NAME EAR_IN MIC_IN GND EAR_OUT MIC_OUT DESCRIPTION Earpiece Input (from audio circuitry) Microphone Input (from microphone) Device Ground Earpiece Output (to earpiece) Microphone Output (to audio circuitry) Ordering Information PART NUMBERING INFORMATION Standard Finish Bumps 5 Package CSP Ordering Part Number1 CM1414-03CS Part Marking CC Lead-free Finish2 Ordering Part Number1 CM1414-03CP Part Marking CC Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. (c) 2005 California Micro Devices Corp. All rights reserved. 2 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 1A www.calmicro.com 11/03/05 CM1414 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 300 UNITS C mW mW STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING -40 to +85 UNITS C ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1) SYMBOL R1 R2 C1 C2 ILEAK VSIG PARAMETER Resistance Resistance Capacitance Capacitance Diode Leakage Current Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Cut-off frequency 1; Note 6 Cut-off frequency 2; Note 6 VIN=5.0V ILOAD = 10mA 5 -15 15 8 Notes 2,3,4 and 5 +15 -19 R = 10, C = 100pF R = 68, C = 47pF 33 61 V V MHz MHz 7 -10 CONDITIONS MIN 9 54 80 38 TYP 10 68 100 47 MAX 11 75 120 57 1.0 15 -5 UNITS pF pF A V V kV kV VESD Notes 2,4 and 5 VCL fC1 fC2 Note 1: TA=25C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open Note 5: The parameters are guaranteed by design. Note 6: ZSOURCE=50, ZLOAD=50 (c) 2005 California Micro Devices Corp. All rights reserved. 11/03/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 3 CM1414 Performance Information Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 1. Earpiece Circuit (A1-C1) EMI Filter Performance Figure 2. Microphone Circuit (A3-C3) EMI Filter Performance (c) 2005 California Micro Devices Corp. All rights reserved. 4 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 11/03/05 CM1414 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER Pad Size on PCB Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance -- Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste VALUE 0.275mm Round Non-Solder Mask defined pads 0.325mm Round 0.125 - 0.150mm 0.330mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50m +20m 60 seconds 240C 260C Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. Figure 3. Recommended Non-Solder Mask Defined Pad Illustration 250 Temperature (C) 200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 4. Eutectic (SnPb) Solder Ball Reflow Profile (c) 2005 California Micro Devices Corp. All rights reserved. 11/03/05 Figure 5. Lead-free (SnAgCu) Solder Ball Reflow Profile 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 5 CM1414 Mechanical Details CSP Mechanical Specifications CM1414 devices are packaged in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document. Mechanical Package Diagrams BOTTOM VIEW A1 B2 B1 C B A A2 C1 B4 B3 OptiGuardTM Coating PACKAGE DIMENSIONS Package Bumps Dim A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Millimeters Min Nom Max Min Custom CSP 5 Inches Nom Max 123 0.905 0.950 0.995 0.0356 0.0374 0.0392 1.365 1.410 1.455 0.0537 0.0555 0.0573 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.245 0.250 0.255 0.0096 0.0098 0.0100 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.175 0.225 0.275 0.0069 0.0089 0.0108 0.220 0.270 0.320 0.0087 0.0106 0.0126 0.575 0.644 0.714 0.0226 0.0254 0.0281 0.368 0.419 0.470 0.0145 0.0165 0.0185 3500 pieces 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS DIMENSIONS IN MILLIMETERS D1 D2 SIDE VIEW Package Dimensions for CM1414 Chip Scale Package C2 # per tape and reel Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CM1414 CHIP SIZE (mm) 1.41 X 0.95 X 0.644 POCKET SIZE (mm) B0 X A0 X K0 1.52 X 1.07 X 0.720 Po Top Cover Tape TAPE WIDTH W 8mm REEL DIAMETER 178mm (7") QTY PER REEL 3500 P0 4mm P1 4mm 10 Pitches cumulative tolerance on tape 0.2 mm Ao W Bo Ko For tape feeder reference only including draft. Concentric around B. Embossment P1 User direction of feed Center lines of cavity Figure 6. Tape and Reel Mechanical Data (c) 2005 California Micro Devices Corp. All rights reserved. 6 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 11/03/05 |
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